Title:
【発明の名称】印刷回路を有する成形品の製造方法およびその製造に使用する転写シ-ト
Document Type and Number:
Japanese Patent JPH071824
Kind Code:
B2
More Like This:
JP5200187 | Metal leaf with carrier |
JPS6381896 | MANUFACTURE OF MOLDED UNIT WITH TRANSCRIPTED CIRCUIT |
JPH01268094 | MANUFACTURE OF ELECTRIC CIRCUIT BOARD |
Inventors:
Eguchi Katsuhide
Yoshimura Isao
Yoshimura Isao
Application Number:
JP4820286A
Publication Date:
January 11, 1995
Filing Date:
March 05, 1986
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K3/20; B41F16/00; (IPC1-7): H05K3/20
Attorney, Agent or Firm:
Sou Suga
Next Patent: MOLDABLE TRANSFER FOIL