Title:
【発明の名称】半導体素子のための検査用回路基板の使用方法
Document Type and Number:
Japanese Patent JP2852976
Kind Code:
B2
Inventors:
KAWASAKI YOGO
TSUKADA KYOTAKA
TSUKADA KYOTAKA
Application Number:
JP40803890A
Publication Date:
February 03, 1999
Filing Date:
December 27, 1990
Export Citation:
Assignee:
IBIDEN KK
International Classes:
G01R1/06; G01R31/26; H01L21/66; (IPC1-7): H01L21/66; G01R1/06; G01R31/26
Domestic Patent References:
| JP6481333A | ||||
| JP4226046A | ||||
| JP58194347A | ||||
| JP60130147A | ||||
| JP6510122A | ||||
| JP5508736A |
Attorney, Agent or Firm:
Hironori Takenori