Title:
【発明の名称】新規なスルーホールめっき印刷回路基板およびその製造方法
Document Type and Number:
Japanese Patent JP2657423
Kind Code:
B2
Abstract:
Through-hole plated single or multi-layer printed circuit boards (PCB's) are mfd. from a polymeric or ceramic substrate material, opt. provided on both sides with at least one electroconductive layer (by electroplating or electroless plating with metal), by a process providing plating on surfaces not coated with a conductive metal layer and including the through-holes. The process involves (a) pre-treating the substrate surfaces with an oxidising soln. (I); (b) removing residual (I) by rinsing, then treating with a soln. (II) contg. monomer selected from pyrrole, furnane, thiophene or derivs. and (c) transferring to an acid soln. (III) to cuase polymerisation of monomer into an surfaces conductive polymer layer (typically 0.1-10 microns thick). Residual (III)may be removed by rinsing, and galvanic or electroless metallisation carried out. Pref. prior to step (a), the substrate is subjected to a pretreatment of initial and surface prepn. of its non-conductive areas.
Inventors:
FUUPE YURUGEN
KUROONENBERUKU UARUTAA
KUROONENBERUKU UARUTAA
Application Number:
JP50257289A
Publication Date:
September 24, 1997
Filing Date:
March 01, 1989
Export Citation:
Assignee:
BURASUBERUKU OOBERUFUREHIENTEHINIIKU GMBH
International Classes:
C08G61/12; C25D5/54; C25D7/00; H01B1/12; C25D5/56; H05K3/28; H05K3/42; H05K3/46; (IPC1-7): H05K3/42; C25D5/56; C25D7/00; H05K3/46
Domestic Patent References:
| JPS6223195A | 1987-01-31 | |||
| JPS62136709A | 1987-06-19 | |||
| JPS61285216A | 1986-12-16 |
Other References:
ＩＢＭ Ｔｅｃｈｎｉｃａｌ Ｄｉｓｃｌｏｓｕｒｅ Ｂｕｌｌｅｔｉｎ Ｖｏｌ．２２，Ｎｏ．１，Ｊｕｎｅ１９７９，３９３頁
Attorney, Agent or Firm:
Yasuo Yanagawa