Title:
【発明の名称】マイクロメカニカル装置の表面処理方法及び得られる装置
Document Type and Number:
Japanese Patent JP3320821
Kind Code:
B2
Inventors:
Larry Jay Hornbeck
Application Number:
JP5425993A
Publication Date:
September 03, 2002
Filing Date:
March 15, 1993
Export Citation:
Assignee:
Texas Instruments Incorporated
International Classes:
C23C14/02; B81B3/00; C23C14/24; C23F4/00; G02B5/08; G02B7/18; G02B26/08; (IPC1-7): G02B26/08; G02B5/08; G02B7/18
Domestic Patent References:
| JP61282817A | ||||
| JP61284128A | ||||
| JP6235321A | ||||
| JP3174112A | ||||
| JP4211216A | ||||
| JP4230725A | ||||
| JP6230726A | ||||
| JP6362868A | ||||
| JP3240949A | ||||
| JP1310538A | ||||
| JP6383255A | ||||
| JP632117A |
Attorney, Agent or Firm:
Akira Asamura (2 outside)