Title:
【発明の名称】微結晶化半導体薄膜を用いる温度センサシステム
Document Type and Number:
Japanese Patent JP2780876
Kind Code:
B2
Inventors:
Atsushi Hiraoka
Furuta Toshio
Furuta Toshio
Application Number:
JP51859695A
Publication Date:
July 30, 1998
Filing Date:
January 03, 1995
Export Citation:
Assignee:
Anritsu Co., Ltd.
International Classes:
A61K31/795; A61F6/04; A61P31/12; A61P31/18; C07C335/06; C07C335/16; C07C335/20; C07F9/09; C07F9/24; C08G18/32; C08G18/38; C08G18/71; G01K1/08; G01K7/16; H01C7/00; (IPC1-7): G01K7/16; G01K1/08; H01C7/00
Domestic Patent References:
| JP587642A | ||||
| JP476425A | ||||
| JP3504048A | ||||
| JP5332845A |
Other References:
【文献】国際公開88/3319(WO,A1)
Attorney, Agent or Firm:
Takehiko Suzue (3 outside)