Title:
熱伝導性熱ラジカル硬化性シリコーン組成物を形成するためのＩＮＳＩＴＵ法
Document Type and Number:
Japanese Patent JP6408491
Kind Code:
B2
Abstract:
An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator.
Inventors:
Intern
James Tonju
A Flows The Lisphi
James Tonju
A Flows The Lisphi
Application Number:
JP2015557174A
Publication Date:
October 17, 2018
Filing Date:
February 10, 2014
Export Citation:
Assignee:
Dow Silicones Corporation
International Classes:
C08F290/06; C08K3/013; C08K5/14; C08K5/5415; C08K9/06; C08L83/07
Domestic Patent References:
| JP2016513151A | ||||
| JP2016506992A | ||||
| JP2013510227A | ||||
| JP2014505114A | ||||
| JP2003327659A | ||||
| JP9316109A | ||||
| JP5186478A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Shinya Mitsuhiro