PURPOSE: To attain the mass production of an IC card by incorporating an IC package containing an external connection terminal and a lead on its surface and side surface respectively to a card base board made of a multi-layer lamination sheet.

CONSTITUTION: The surface of an IC package 3 containing an external connection terminal 2 on its surface is exposed to the surface of an IC card 1. A lead part 6 has a projection 6a at its center and through holes 6b and 6c at both sides respectively. The projection 6a is set vertical to the paper surface and can be exposed over the surface of the package 3. The hole 6b functions to secure communication for the resin mold of the package 3 at upper and lower sides of the part 6 and therefore fix tightly both resin mold and part 6.