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Title:
IC CARD AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2013003954
Kind Code:
A
Abstract:

To provide an IC card such that a gap between an IC module embedded in a card base material and the card base material is inconspicuous as an IC card capable of performing contact type communication.

There is provided the IC card including the card base material formed by stacking at least one or more layers of white or light-permeable core materials and one or more layers of white or light-permeable outer package base materials, and an IC module having at least an external connection terminal and an IC chip connected to the external connection terminal. The IC card is characterized in having a surface chromatic layer at least in an area including a periphery of an opening of a recessed part of the IC module on an outermost surface of the card base material and also having an intermediate chromatic layer between layers of the card base materials. The intermediate chromatic layer includes the opening of the recessed part at least in plan view, and is formed larger than the area of the opening part of the recessed part, which is formed penetrating the intermediate chromatic layer.


Inventors:
WAKANA MASAHIKO
Application Number:
JP2011136153A
Publication Date:
January 07, 2013
Filing Date:
June 20, 2011
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
G06K19/077; B42D15/10
Domestic Patent References:
JPH0531983U1993-04-27
JPH01120393A1989-05-12
JP2005022297A2005-01-27
JPS62290594A1987-12-17
JPS63209896A1988-08-31



 
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