Title:
IC CARD AND MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2005301795
Kind Code:
A
Abstract:
To propose a manufacturing method of an IC card capable of mounting an electrophoretic display device on an IC card while performing the moisture preventive treatment of the electrophoretic display device and the flatting of the surface of the IC card.
The manufacturing method of the IC card K mounted with the electrophoretic display device 10 comprises steps of disposing a base material 61 having an opening part 61b for storing the electrophoretic display device 70 on an inlet 70 with the device 10 arranged thereon; and filling a transparent moisture-proof resin 21 in the opening part 61b so as to surround the upper part and circumferential side surface of the device 10 to form a moistureproof part 20.
Inventors:
MIYAZAKI ATSUSHI
TAKAO HIROKI
KARAKI EIJI
TAKAO HIROKI
KARAKI EIJI
Application Number:
JP2004118840A
Publication Date:
October 27, 2005
Filing Date:
April 14, 2004
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B42D15/10; G02F1/167; G06K19/07; G06K19/077; (IPC1-7): G06K19/07; B42D15/10; G02F1/167; G06K19/077
Attorney, Agent or Firm:
Kazuya Nishi
Masatake Shiga
Masakazu Aoyama
Masatake Shiga
Masakazu Aoyama