Title:
IC CARRIER
Document Type and Number:
Japanese Patent JP2768920
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make wiring sheets pinch firmly between a carrier base and a carrier cover by a method wherein coupling pins, which are projected from the opposed surface on one side of the opposed surfaces of either of the base and the cover, are pressed into coupling holes provided in the other opposed surface of the base or the cover throug holes provided in the sheets.
SOLUTION: Coupling pins 9, which are pressed into coupling holes 10 provided in a carrier base 1, are projected from the surface on one side of the surfaces of a carrier cover 8 onto the diagonal lines of the cover 8 and a taper is provided on the points of the pins 9. The length of the pins 9 is formed into the length of the pins 9, which does not project from the rear of the base 1, when the cover 8 is closed and jointed with the base 1. The pins 9 of the cover 8 are pressed into the holes 10 provided in the base 1 through holes 16, flexible wiring sheets 5 are firmly pinched between the cover 8 and the base 1 along with a back-up frame 6 and the position of the sheets 5 to an IC is properly held.
More Like This:
| JP2010129559 | HIGH-FREQUENCY CIRCUIT UNIT |
| JPH07176664 | SEMICONDUCTOR DEVICE AND FABRICATION THEREOF |
| JPS52123873 | SEALING METHOD OF SEMICONDUCTOR ELEMENTS |
Inventors:
Noriyuki Matsuoka
Utsuji Kazumi
Utsuji Kazumi
Application Number:
JP22724595A
Publication Date:
June 25, 1998
Filing Date:
August 11, 1995
Export Citation:
Assignee:
Yamaichi Electric Co., Ltd.
International Classes:
H01L23/12; H01L23/32; H01R33/76; H01R33/94; (IPC1-7): H01L23/32; H01R33/76; H01R33/94
Domestic Patent References:
| JP6314757A | ||||
| JP717591A | ||||
| JP8288315A | ||||
| JP8279568A | ||||
| JP722532A | ||||
| JP473942A |
Attorney, Agent or Firm:
Takashi Nakahata