Title:
IC CHIP AND ARRANGEMENT METHOD OF IC CHIP
Document Type and Number:
Japanese Patent JP2013045286
Kind Code:
A
Abstract:
To provide an IC chip, even if being installed in a concrete body, securing mechanical strength and safety of construction and surely achieving the durability of several decades unit with neither reducing an amount of concrete to be used nor being handled as a foreign substance, and an arrangement method thereof in the concrete.
An IC chip 1 includes an IC chip body 2 that is covered with a covering material 2 having alkali resistance and water resistance.
Inventors:
UEHARA NOBUO
Application Number:
JP2011182658A
Publication Date:
March 04, 2013
Filing Date:
August 24, 2011
Export Citation:
Assignee:
SUMITOMO OSAKA CEMENT CO LTD
International Classes:
G06K19/077; B28B23/00; G06K19/00; G06K19/07
Domestic Patent References:
| JP2008040704A | 2008-02-21 | |||
| JP2008137284A | 2008-06-19 | |||
| JPH11102424A | 1999-04-13 | |||
| JP2000036024A | 2000-02-02 | |||
| JP2010054448A | 2010-03-11 |
Attorney, Agent or Firm:
Tamura
Junko Sugimura
Junko Sugimura