Title:
IC MODULE AND IC CARD USING THE SAME
Document Type and Number:
Japanese Patent JP2006195618
Kind Code:
A
Abstract:
To provide an IC card capable of preventing contact of a stiffening plate for moderating external stress, such as bending added to an IC chip, pressure, or shock, with a circuit pattern formed on a substrate.
In the IC module 20 provided with the substrate 27, the IC chip 22 mounted on the substrate 27, and the stiffening plate arranged on an upper part of the IC chip 22 via a resin 25, the circuit pattern 28a electrically connected to the IC chip 22 and the circuit pattern 28b are electrically connected on the side of the IC chip 22 through a through hole 30 at an end part of the stiffening plate 23 on the substrate 27.
Inventors:
SAITO AKIHIKO
Application Number:
JP2005004809A
Publication Date:
July 27, 2006
Filing Date:
January 12, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G06K19/077; B42D15/10; G06K19/07
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito
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