Title:
IC MODULE, AND IC MODULE-MOUNTED MEDIUM
Document Type and Number:
Japanese Patent JP2018097724
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an IC module capable of suitably applying to both contact communication and non-contact communication, and a medium on which the same IC module is mounted.SOLUTION: An IC module 30 comprises: a sheet-like module base material; an IC chip which is provided on a first surface of the module base material, is provided with functions of both a contact type transmission function and a non-contact type transmission function, and is formed with a first terminal and a second terminal; a connection coil which is a non-contact transmission mechanism formed in a spiral shape around the IC chip on the first surface of the module base material; and a plurality of contact terminals 35 which are contact type transmission elements provided on a second surface of the module base material and are electrically insulated from each other. Each of the plurality of contact terminals 35 has a conductor non-arrangement region 38 in which no conductor is disposed on at least a part of the peripheral edge.SELECTED DRAWING: Figure 6
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Inventors:
MIZOGUCHI YOSHINOSUKE
TSUKADA TETSUYA
TSUKADA TETSUYA
Application Number:
JP2016243365A
Publication Date:
June 21, 2018
Filing Date:
December 15, 2016
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
G06K19/077; B42D25/305; H01L23/12; H01Q7/00; H05K1/14; H05K1/16; H05K3/46
Domestic Patent References:
| JP2015511353A | 2015-04-16 |
Foreign References:
| WO2013073702A1 | 2013-05-23 |
Attorney, Agent or Firm:
Shiro Suzuki
Masatake Shiga
Tadashi Takahashi
Shunsuke Fushimi
Masatake Shiga
Tadashi Takahashi
Shunsuke Fushimi