Title:
IC MOUNTING METHOD
Document Type and Number:
Japanese Patent JPH05235103
Kind Code:
A
Abstract:
PURPOSE: To obtain a connection whose reliability is high by a method wherein an electric short circuit which is caused when a conductive adhesive comes into contact with contacts is solved and the transfer amount of the conductive adhesive is stabilized in an IC mounting method wherein an IC chip is connected to a circuit board.
CONSTITUTION: In order to stably transfer a conductive adhesive 6 to each protrusion contact 3 formed on each electrode pad 2 on an IC chip 1, a slight vibration is given, by means of an ultrasonic vibration apparatus 12, to a conductive adhesive layer 7 formed on a support body 9 when the conductive adhesive is transferred, and the conductive adhesive 6 is transferred by enhancing its wettability.
Inventors:
KISHIMOTO KUNIO
TAKENAKA TOSHIAKI
TAKENAKA TOSHIAKI
Application Number:
JP3906992A
Publication Date:
September 10, 1993
Filing Date:
February 26, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/60; H01L21/321
Attorney, Agent or Firm:
Akira Kobiji (2 outside)
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