IC MOUNTING STRUCTURE OF MULTICHIP MODULE

Title:

IC MOUNTING STRUCTURE OF MULTICHIP MODULE

Document Type and Number:

Japanese Patent JPH06275740

Kind Code:

A

Abstract:

PURPOSE: To provide an IC chip mounting structure of multichip module which minimizes the area required for IC mounting, and thereby meet demands for miniaturization and weight reduction.

CONSTITUTION: A plurality of IC chips 4 are simultaneously placed in recesses formed in a substrate 1. Connection between the IC chips and the substrate is achieved through bonding wires and terminals formed on the surface of steps 3 for connection, which is so constituted that the difference in height from the upper faces of the IC chips is smaller than the thickness of the IC chips. The recesses holding the IC chips are hermetically sealed using a single lid.

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Inventors:

EZAKI TORU
YAMAKAWA TAKAHIRO
SUGANO OSAMU
TAKAHASHI SHIGERU

Application Number:

JP8794193A

Publication Date:

September 30, 1994

Filing Date:

March 23, 1993

Export Citation:

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Assignee:

NIHON CEMENT

International Classes:

H01L23/12; H01L25/04; H01L25/18; (IPC1-7): H01L23/12; H01L25/04; H01L25/18

Attorney, Agent or Firm:

Masatoshi Iwane

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