Title:
IC PACKAGE, IC MODULE, AND NON-CONTACT IC CARD
Document Type and Number:
Japanese Patent JP2014178875
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce a possibility that an IC chip is destroyed by an impact force from the outside without increasing a thickness.SOLUTION: An IC chip 10 mounted on a lead frame 11 is sealed by a sealing resin 14. On a surface on the side opposite to the lead frame 11 of the sealing resin 14, a reinforcing layer 15 is provided through an adhesive layer 16.
Inventors:
MATSUMOTO KEIICHI
MATSUOKA HIDEAKI
NISHIMURA HIDEKAZU
MATSUOKA HIDEAKI
NISHIMURA HIDEKAZU
Application Number:
JP2013052260A
Publication Date:
September 25, 2014
Filing Date:
March 14, 2013
Export Citation:
Assignee:
HITACHI MAXELL
International Classes:
G06K19/077; B42D25/305; G06K19/07; H01L23/29; H01L23/31
Domestic Patent References:
| JP2004234593A | 2004-08-19 | |||
| JPH01208847A | 1989-08-22 | |||
| JP2002366922A | 2002-12-20 |
Foreign References:
| WO2011024844A1 | 2011-03-03 |
Attorney, Agent or Firm:
Patent business corporation Ikeuchi and Sato and partners
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