Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
IC PELLET
Document Type and Number:
Japanese Patent JPS63262834
Kind Code:
A
Abstract:

PURPOSE: To avoid the break of a pellet at the time of manufacture and improve the yield and the reliability of product by chamfering the corner of the pellet.

CONSTITUTION: A pellet 1 wherein the corner 3 is out is obtained by making a V-shape scribing groove 2 at the time of wafer dicing and by rupturing. After the die bonding of the pellet, the bonding pad of the pellet and the electrode of a container are connected with a wire 4. This avoids the break of the pellet because the collision of the collet of a mounter with the corner of the pellet at the time of the die bonding is prevented. Then, at the time of wire bonding, the yield of a product is improved because the interval between the wire and the pellet is made greater and the contact of the wire with corner of the pellet is prevented. Furthermore, a voil or a pin hole is reduced by improving the flow of a resin at the time of transfer molding.


Inventors:
NISHIAKI EIJI
Application Number:
JP9777387A
Publication Date:
October 31, 1988
Filing Date:
April 20, 1987
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NEC CORP
International Classes:
H01L21/301; H01L21/02; H01L21/52; H01L21/78; (IPC1-7): H01L21/02; H01L21/52; H01L21/78
Domestic Patent References:
JPS58143519A1983-08-26
JPS6199354A1986-05-17
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)