To provide a test IC socket of a BGA(ball grid array) package enabling to surely prevent pulling-out and slippage of terminals even when press- fitting force of terminal fixing parts gets beaten by force of springs of pin socket contacting parts.

Terminal terminal fixing parts 1c of terminals 1 composed of a contacting part 1a, a spring part 1b, a terminal terminal fixing part 1c and a terminal terminal lead 1d are inserted and fixed into first fixing holes 3 formed in a bottom part 2a of an IC socket body 2. Then, the terminals 1 are inserted into second fixing holes 9 provided in a fixing plate 4, and the plate 4 is put on the upper surface of the bottom part 2a of the IC socket body 2. Thus, the terminal terminal fixing parts 1c are pressed from above by peripheral parts of the second fixing holes 9.