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Patent Searching and Data


Title:
IC SOCKET
Document Type and Number:
Japanese Patent JPH02270278
Kind Code:
A
Abstract:

PURPOSE: To make a probe easily disconnected and connected, and also to make correct electrical measurements/analyses by drawing part of each contact in an IC socket outside a moulded resin to form a terminal.

CONSTITUTION: There are provided a terminal 7 prepared through the process of drawing part of each contactor 3 outside an IC socket 9 and the IC socket 9. Namely, the IC socket is constructed in such a process that part of each contact 2 in the IC socket 9 is drawn out to form the terminal 7. This process accordingly makes it unnecessary to add any pin to the socket. In order to also make the electrical measurements/analyses of a semiconductor element 4 mounted on the IC socket 9, a probe 6 is connected to each of the terminals 7 for examining the semiconductor element 4 for its properties and then changing the connection of the probe 6 to each of the terminals 7 so that another part of the semiconductor element 4 is examined for its properties. Thus, disconnecting and connecting the probe 6 or the like may be facilitated to prevent the semiconductor element from any damage as well as obtaining proper electrical measurements/analysis results.


Inventors:
OKUBO SHINJI
Application Number:
JP9101389A
Publication Date:
November 05, 1990
Filing Date:
April 10, 1989
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01R13/11; H01L23/32; H01R33/76; (IPC1-7): H01L23/32; H01R13/11; H01R33/76
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)