Title:
IC SOCKET
Document Type and Number:
Japanese Patent JPH05144529
Kind Code:
A
Abstract:
PURPOSE: To prevent the deformation of a lead when it is in a loading contact as well as in a pressure contact, for an loading contact type IC socket, in which the lead of an IC is pressurized in loading contact with a contact.
CONSTITUTION: A loading board 2 for supporting an IC is pushed down, while a lead 11 separated from a contact 3 is loaded and is in contact with a contact by tare. After the loading, the loading board 2 is further pushed down and the IC is floated up from the loading board 2, and while the loading board 2 is pushed down under this condition of floating up, the lead is pushed down so as to pressurize the contact and to make it in contact with the contact 3.
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Inventors:
URATSUJI KAZUMI
SAGANO HIDEKI
SAGANO HIDEKI
Application Number:
JP33149691A
Publication Date:
June 11, 1993
Filing Date:
November 19, 1991
Export Citation:
Assignee:
YAMAICHI ELECTRIC CO LTD
International Classes:
H01L23/32; H01R33/76; H01R33/94; (IPC1-7): H01L23/32; H01R33/76; H01R33/94
Domestic Patent References:
| JPH02250282A | 1990-10-08 |
Attorney, Agent or Firm:
Takashi Nakahata