PURPOSE: To make it possible to increase a mounting area for a wiring pattern or other components by providing sufficient connection strength against the removal of loaded IC components, and by reducing the number of throughholes for a circuit board.

CONSTITUTION: There are provided an insulating support member 2 (socket body) where a plurality of paired electrode terminals are installed on the top so as to connect electrically to an input and output electrode pad of a loaded IC component and lead terminals 9a which are electrically connected to a wiring board where one end is connected to an electrode terminal 3 on the surface of the insulating support 2 while the other end is pulled out from the insulating support member 2 and mounted. Furthermore, a part of the lead terminal 9a is pulled out virtually vertically to the bottom side of the insulating support member 2 (socket main body) in such a fashion that it may be connected and fixed in a throughhole bored on the circuit board, and what is more, a part of the other electrode 9b is pulled out to the side of the insulating support member 2 in such a fashion that is may be connected to the connection pad on the circuit board side.