To provide an image pickup element for an electronic endscope and an endscope which are manufactured easily and have a high manufacturing yield.

A CCD image sensor 5 has a CCD chip 51 and a microlens array 53. A plurality of bump members 55 are provided on the image pickup surface of the CCD chip 51, and leads 56 are electrically connected to these bumps respectively. Also, a cover glass 50 is bonded with the image pickup surface 52 side of the CCD chip 51 by an adhesive. Also, a frame-shaped wall part 54 which is square in plan view is provided on the image pickup surface 52 side of the CCD chip 51. The wall part 54 is arranged in the position corresponding to a light shielding region 522, and the wall part 54 prevents the adhesive 57 from entering an effective image pickup region 523 when the cover glass 50 is bonded. Furthermore, a coated layer 58 is formed on the rear surface side and the side surface side of the CCD image sensor 5.