Title:
撮像装置及びその製造方法
Document Type and Number:
Japanese Patent JP7116591
Kind Code:
B2
Abstract:
An imaging device includes a first substrate including a photoelectric conversion layer that includes a first semiconductor layer of a first conductivity type and a second semiconductor layer of a second conductivity type and in which a plurality of photoelectric conversion units are provided; a second substrate that is joined to the first substrate and in which a readout circuit substrate that outputs a signal based on information detected by the plurality of photoelectric conversion units is provided; and an element isolation portion defined by a first opening provided so as to penetrate the second substrate and at least one of the first semiconductor layer and the second semiconductor layer, and each of the plurality of photoelectric conversion units is separated from each other by the element isolation portion.
Inventors:
Takahiro Yajima
Application Number:
JP2018096197A
Publication Date:
August 10, 2022
Filing Date:
May 18, 2018
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L27/146; H01L21/02; H01L21/3205; H01L21/76; H01L21/768; H01L23/522; H04N5/369
Domestic Patent References:
| JP2007281266A | ||||
| JP2014232761A | ||||
| JP2011049445A | ||||
| JP2017157803A |
Attorney, Agent or Firm:
Okabe
Takao Ochi
Koji Yoshizawa
Masami Saito
Takao Ochi
Koji Yoshizawa
Masami Saito