Title:
撮像モジュールの製造方法
Document Type and Number:
Japanese Patent JP7344924
Kind Code:
B2
Abstract:
A molded photosensitive assembly of an image capturing module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of lead wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
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Inventors:
King Pearl
Takehiko Tanaka
Guo Kusunoki
Chen Zhenyu
Zhao Nami Jie
Tetsufumi Ume
黄 ▲貞▼
Jung Woo
Takehiko Tanaka
Guo Kusunoki
Chen Zhenyu
Zhao Nami Jie
Tetsufumi Ume
黄 ▲貞▼
Jung Woo
Application Number:
JP2021060338A
Publication Date:
September 14, 2023
Filing Date:
March 31, 2021
Export Citation:
Assignee:
Ning Hashun Umitsu Den
International Classes:
H04N23/57; G02B7/02; G02B7/04; G03B11/00; G03B17/02; H04N23/55; H05K5/00
Domestic Patent References:
| JP2008283002A | ||||
| JP2003219284A | ||||
| JP11341365A | ||||
| JP6317765A | ||||
| JP2010213034A | ||||
| JP2012095177A | ||||
| JP2011035458A | ||||
| JP2004282227A | ||||
| JP2000332225A | ||||
| JP61006869A | ||||
| JP2006303481A | ||||
| JP2011187482A |
Attorney, Agent or Firm:
Momoko Arima