To avoid foreign matters on the surface of an image sensor chip and to simplify the structure of an imaging module by reducing the number of constituent components, thereby reducing the number of assembling steps, increasing the accuracy of assembling, and eliminating the need of optical adjustment.
An outer peripheral bottom surface 2d of a lens casing 2 at its back side is provided with a plurality of height-directional positioning parts 2b, which abut directly against the surface of an imaging chip. Since the lens casing 2 for housing condensing lenses 3a, 3b therein is fitted to an outer frame holder 1 to be freely rotatable therein, even if there is a foreign matter D on the surface of the sensor chip (imaging chip), it is possible to avoid the position of the foreign matter D, by making the height-directional positioning parts 2b of the lens casing 2 turn.
COPYRIGHT: (C)2010,JPO&INPIT
KARAKI SATORU
FUKAMACHI TAKAYUKI
HIROOKA SHOGO
Takaaki Yasumura
Takeshi Oshio