Title:
IMIDE MODIFIED EPOXY RESIN MATERIAL
Document Type and Number:
Japanese Patent JPH04266923
Kind Code:
A
Abstract:
PURPOSE:To obtain the title material useful as a resin material of laminate for printed-wiring board, having excellent heat resistance, water-vapor resistance, adhesiveness, etc., by making a specific imide resin as a prepolymer and an epoxy resin into a polymer alloy. CONSTITUTION:An imide resin (e.g. bismaleimide) containing plural unsaturated double bonds as a prepolymer is blended with an epoxy resin (e.g. bisphenol A type epoxy resin) in a blending ratio of 5-30:95-70 by weight and made into a polymer alloy in a solvent such as THF to give the objective material. The material is preferably mixed with a curing agent (2-8/100 resin based on total amount of resin), a curing auxiliary (0.05-0.04/100 resin), a flame-retardant, a filler, etc.
Inventors:
SAITO EISAKU
Application Number:
JP2883491A
Publication Date:
September 22, 1992
Filing Date:
February 22, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B32B15/08; B32B27/04; C08G59/40; C08G59/56; C08J5/24; C08L63/10; H05K1/03; (IPC1-7): B32B15/08; B32B27/04; C08G59/40; C08G59/56; C08J5/24; C08L63/10; H05K1/03
Attorney, Agent or Firm:
Toshio Nishizawa