Title:
IMMERSION COOLING PACKAGE STRUCTURE
Document Type and Number:
Japanese Patent JPH05235225
Kind Code:
A
Abstract:
PURPOSE: To provide an immersion cooling package structure, especially an immersion cooling package structure for cooling a package mounted on a substrate by immersing a unit substrate into immersion liquid wherein even a central part of a package is cooled.
CONSTITUTION: In an immersion cooling package structure for cooling a package in a condition that a heat sink 4 is formed on a heat dissipation plate, at least one substantially L-shaped pipe 5 is provided on the upper plate 4a of the heat skin 4. Its end part has an opening 5a on the side of the heat sink 4 and also its other end part has an opening 5b above the heat sink 4.
Inventors:
MOCHIZUKI MASAHIRO
Application Number:
JP3176692A
Publication Date:
September 10, 1993
Filing Date:
February 19, 1992
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L23/36; H01L23/44; H05K7/20; (IPC1-7): H01L23/44; H01L23/36; H05K7/20
Attorney, Agent or Firm:
Masao Yamakawa