Title:
IMPEDANCE MEASURING METHOD AND WIRING BOARD
Document Type and Number:
Japanese Patent JP2004037219
Kind Code:
A
Abstract:
To enable the measurement of characteristic impedance and differential impedance by using a space of a wiring board efficiently.
About one out of two conductors constituting a differential impedance test pattern 104, conductor of a characteristic impedance test pattern 105 is connected.
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Inventors:
HASEGAWA KENJI
Application Number:
JP2002194101A
Publication Date:
February 05, 2004
Filing Date:
July 03, 2002
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
G01R27/04; G01R27/02; H05K1/11; H05K3/00; (IPC1-7): G01R27/04; G01R27/02; H05K1/11; H05K3/00
Attorney, Agent or Firm:
Hideaki Togawa