Title:
IMPELLER FOR CIRCUMFERENTIAL FLOW PUMP
Document Type and Number:
Japanese Patent JP3907888
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To simplify a structure of a mold for injection molding without generating a weld phenomenon.
SOLUTION: This impeller 2 for a circumferential flow pump 1 is provided with a plurality of vane grooves 12 on the outer periphery of a synthetic resin- made disc-shaped member 8 to be rotated by a motor 3a, and it is rotatably housed in an approximately disc-shaped space 6 formed between a pump casing 4 and a pump cover 5. A shaft hole 15 to be engaged with a drive shaft 21 of the motor 3a is housed in the central part of the disc-shaped member 8, and a pressure adjusting groove 17 opened to both side surfaces 10, 11 of the disc-shaped member 8 are formed on the shaft hole 15. An annular recessed part 18 on which a ring gate 20 for injection molding is to be arranged is formed in the position separated from outer peripheral side of the shaft hole 15 by the specified size. the pressure adjusting groove 17 functions so as to keep the balance of pressure acting on both side surfaces 10, 11 of the impeller 2.
Inventors:
Ryoichi Nakata
Application Number:
JP30671799A
Publication Date:
April 18, 2007
Filing Date:
October 28, 1999
Export Citation:
Assignee:
Enplus Inc.
International Classes:
F02M37/10; F04D5/00; F04D23/00; F04D29/18; (IPC1-7): F04D23/00; F02M37/10
Domestic Patent References:
| JP57163149A | ||||
| JP10259789A |
Attorney, Agent or Firm:
Hiroyoshi Katsumata
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