Title:
実装システム
Document Type and Number:
Japanese Patent JP6498764
Kind Code:
B2
Abstract:
In a mounting system including multiple mounting machines, there is provided a mounting system that is capable of reducing the number of measurement devices that measure electrical characteristics of an electronic component. A control device 13 controls a switching device 12 in order to connect a measurement device 14 and a mounting machine 16 that transmitted request information for measuring the electrical characteristics of the electronic component. When transmitting an instruction for starting measurement to the measurement device 14 and receiving a characteristic measurement value from the measurement device 14, the control device 13 transfers the received characteristic measurement value to the mounting machine 16 that transmitted request information.
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Inventors:
Mitsuhiko Shibata
Application Number:
JP2017524201A
Publication Date:
April 10, 2019
Filing Date:
June 17, 2015
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/08; G01R31/00; H05K13/00
Domestic Patent References:
| JP2015103639A | ||||
| JP10142281A |
Foreign References:
| WO2013186861A1 |
Attorney, Agent or Firm:
Patent business corporation NEXT
Yasutaka Fukatsu
Yuki Kataoka
Yasutaka Fukatsu
Yuki Kataoka