Title:
インプリント方法及び製造方法
Document Type and Number:
Japanese Patent JP7023744
Kind Code:
B2
Abstract:
An imprinting method for forming a pattern on a substrate with use of a mold, includes performing a running-in process in which the mold is brought into contact with a composition on a first substrate held by a holding unit, the composition on the first substrate is exposed, and the mold is released. After the running-in process, the method includes performing an imprinting process in which the mold is brought into contact with a composition on a second substrate, the composition on the second substrate is exposed, the mold is released, and the pattern is formed on the composition on the second substrate. A base material of the first substrate is higher in heat conductivity than a base material of the second substrate. The second substrate is used as an imprint mold.
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Inventors:
Tsutomu Hashimoto
Yamato
Yamato
Application Number:
JP2018035311A
Publication Date:
February 22, 2022
Filing Date:
February 28, 2018
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L21/027; B29C33/38; B29C59/02; B81C99/00
Domestic Patent References:
| JP2016066791A | ||||
| JP2018019064A | ||||
| JP2009065135A | ||||
| JP2011205039A | ||||
| JP2006528088A | ||||
| JP2016025230A | ||||
| JP2015533692A |
Foreign References:
| US20080145525 | ||||
| CN107216655A |
Attorney, Agent or Firm:
Takuma Abe
Sougo Kuroiwa
Sougo Kuroiwa
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