Title:
改良組立て及び分解法、システム及びコンポーネント
Document Type and Number:
Japanese Patent JP4778900
Kind Code:
B2
Abstract:
The invention deals with methods for assembly and disassembly, especially suitable for assembly and disassembly by a computer. In relation to assembly, a component (10) is positioned in assembly (70) in accordance with a proposed position. The composent (10) is confirmed as being in its correct spatial position in the assembly (70) by sensing means (38) or (46) capable of sensing spatial relationship and/or connection of the component (10) in relation to the assembly (70). Information regarding the sensed spatial relationship and/or connection is communicated to information processing means. A method for disassembly is also disclosed. The assembly and disassembly methods may require steps to be taken in a chosen sequence. The component (10) itself is also described, as is an improved assembly system which includes the component (10) together with information processing means.
Inventors:
Dickory Ladakh
Wilson, John, Kerr
Wilson, John, Kerr
Application Number:
JP2006529357A
Publication Date:
September 21, 2011
Filing Date:
May 13, 2004
Export Citation:
Assignee:
TELEZYGOLOGY Inc.
International Classes:
B23P21/00; B23P19/04; B23Q16/00; B25B27/00; G05B19/418
Domestic Patent References:
| JPH11177299A | 1999-07-02 | |||
| JP2002120119A | 2002-04-23 | |||
| JP2002006919A | 2002-01-11 | |||
| JP2003076966A | 2003-03-14 | |||
| JPH09205291A | 1997-08-05 |
Attorney, Agent or Firm:
Yoshiaki Sato