改良された超音波プローブ変換器アセンブリ及び生産方法

Japanese Patent JP4913814

B2

An improved ultrasound transducer assembly, e.g. a thickness-mode transducer assembly includes a plurality of elements comprising piezoelectric material, and a backing material disposed adjacent to a back surface of the plurality of elements. The piezoelectric material and backing material define at least a portion of a side surface, wherein an electrically conductive material is disposed upon and in contact with at least a portion of the side surface. The elements may comprise one or a plurality of front electrodes, and one or a plurality of back electrodes, wherein the front electrode(s) is electrically interconnected to the electrically conductive material disposed on the side surface portion. In a mass processing method, a plurality of thickness-mode ultrasound probe transducer assemblies may be produced, wherein a plurality of interconnected transducer subassemblies comprising a mass backing are processed in tandem.

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JP2606016	ULTRASONIC PROBE

Zipparo, Michael Joseph
Johnson, Monica Page
Oakley, Clyde Gerald
Dietz, Dennis Raymond
Lovely, Michael Robert
Don How, Mark Nathaniel

JP2008528009A

April 11, 2012

August 18, 2006

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Gore Enterprise Holdings, Inc.

H04R17/00; A61B8/00; H04R31/00

JP2005151559A	2005-06-09
JP2004056504A	2004-02-19
JP2002345063A	2002-11-29
JPH11123188A	1999-05-11
JPH11155859A	1999-06-15
JPH08307996A	1996-11-22
JPH04119800A	1992-04-21
JPS63146699A	1988-06-18
JPS62178100A	1987-08-05
JPH0472900A	1992-03-06

Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Atsushi Ebiya
Masatoshi Takahashi

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