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Title:
IN-PACKAGE SUPPORT STRUCTURE FOR PIEZOELECTRIC VIBRATOR
Document Type and Number:
Japanese Patent JPH11112269
Kind Code:
A
Abstract:

To provide an in-package support structure for the piezoelectric vibrator whose reliability is enhanced, by effectively preventing deficiency of a support strength in the middle of a vibrator raw substrate that is a defect having been caused in a conventional piezoelectric device package where a lower face of one end of the piezoelectric vibrator raw substrate is supported in a cunti- lever state and a pillow member is placed opposite to the other free end lower face in a contactless state, that is, a damage in the middle of the vibrator raw substrate resulting from external shock and vibration or a frequency deviation resulting from amplitude displacement.

In the support structure of the piezoelectric vibrator 21 where one end lower face of the piezoelectric vibrator having an exciting electrode on both front and rear sides of the piezoelectric raw substrate is horizontally supported in a cunti-lever state by an upper face of a support electrode 22 projected to a bottom side in an air-tightly sealed package, a pillow member 25 is projected to an in-package bottom face 20 equivalent to a middle part between one end and the other end of the piezoelectric vibrator supported by the upper support electrode.


Inventors:
KURAHASHI YOSHITAKA
Application Number:
JP28249997A
Publication Date:
April 23, 1999
Filing Date:
September 30, 1997
Export Citation:
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Assignee:
TOYO COMMUNICATION EQUIP
International Classes:
H03H9/02; H03H9/10; H03H9/19; (IPC1-7): H03H9/10; H03H9/02; H03H9/19
Attorney, Agent or Firm:
Suzuki Hitoshi