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Title:
インジウムターゲット部材及びその製造方法
Document Type and Number:
Japanese Patent JP6678528
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an indium target member excellent in stability of film formation rate regardless of the crystal grain size of indium constituting a parent phase.SOLUTION: An indium target member has a copper concentration of 50 mass ppm or more and less than 2500 mass ppm and an oxygen concentration of less than 50 mass ppm, and is composed of residual indium and inevitable impurities. An average particle diameter of Cu-In compound particles is from 0.5 to 8 μm when observing the surface to be sputtered.SELECTED DRAWING: None

Inventors:
Endo Ryosuke
Application Number:
JP2016135285A
Publication Date:
April 08, 2020
Filing Date:
July 07, 2016
Export Citation:
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Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
H01L21/203; B22C9/06; B22D21/00; B22D27/04; B22D27/20; C23C14/14; C23C14/34
Domestic Patent References:
JP5254290B2
JP2009113074A
JP2013253298A
JP2015145530A
JP2015212422A
Foreign References:
WO2015004958A1
CN101392362A
WO2015016320A1
Attorney, Agent or Firm:
Axis International Patent Business Corporation