PURPOSE: To shorten a development time for an application specific IC(ASIC) device and improve a yield in manufacturing.

CONSTITUTION: In a manufacturing step, a plurality of semiconductor devices are arranged in order in at least some part of a semiconductor wafer 1, and two or more types of semiconductor integrated circuit devices are formed by changing their wiring pattern between the semiconductor devices. In this case, a given number of semiconductor wafers, in which the semiconductor devices are connected in a common pattern by using first and second layer aluminum wiring groups 57, are prepared. Then, a given wiring pattern corresponding to a desired type of the semiconductor integrated circuit device is formed in a third aluminum wiring group 59 and a fourth aluminum wiring group 61.