Title:
MANUFACTURE OF CIRCUIT WIRING SUBSTRATE
Document Type and Number:
Japanese Patent JP3152637
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit wiring substrate, wherein a plated film is formed efficiently on an electrode pad part by electroless prating method, growth of the plated film on a not-expected part is surely prevented, and good solder wettabeility is assured at soldering.
SOLUTION: A process in which a wiring conductor pattern is formed on an insulating substrate, a process where a protective film is formed on a wiring conductor pattern except for an electrode pad part of the wiring conductor pattern formed in the process, a process where the electrode pad part is polished, a process where an Ni-B based plating film is formed on the electrode pad part polished in the process, a process where an Ni-P based plating film is formed on the Ni-B based plating film formed in the process, and a process where an Au based plating film is formed on the Ni-P based plating film formed in the process, are provided.
Inventors:
Tatsuki Hirano
Kyohei Seko
Kyohei Seko
Application Number:
JP30407697A
Publication Date:
April 03, 2001
Filing Date:
November 06, 1997
Export Citation:
Assignee:
Kamaya Electric Co., Ltd.
International Classes:
H05K3/24; (IPC1-7): H05K3/24
Domestic Patent References:
| JP5121592A | ||||
| JP3291991A | ||||
| JP653660A | ||||
| JP54105772A |
Attorney, Agent or Firm:
Hajime Sakai