Title:
INJECTION MOLDING MOLD
Document Type and Number:
Japanese Patent JP2008221773
Kind Code:
A
Abstract:
To provide an injection molding mold which can raise heat release efficiency from a molding.
The injection molding mold comprises: a plated layer in which a configuration work of an optical transcriptional surface is given by a cutting work on a substrate; a surface layer arranged in the outside of the plated layer; and an intermediate layer arranged between the plated layer and the surface layer, wherein when the heat conductivity of the thin coating layer is , the heat conductivity of the intermediate layer is , and the heat conductivity of the surface layer is , formula (1) is satisfied.
Inventors:
SHIMIZU TSUTOMU
MASAKI YOSHIHARU
OTA TATSUO
MASAKI YOSHIHARU
OTA TATSUO
Application Number:
JP2007066838A
Publication Date:
September 25, 2008
Filing Date:
March 15, 2007
Export Citation:
Assignee:
KONICA MINOLTA OPTO INC
International Classes:
B29C45/26; B29C33/38
Domestic Patent References:
| JP2000238045A | 2000-09-05 | |||
| JP2003305743A | 2003-10-28 | |||
| JP2005153246A | 2005-06-16 | |||
| JP2000006159A | 2000-01-11 | |||
| JPH06108260A | 1994-04-19 | |||
| JP2002187134A | 2002-07-02 | |||
| JP2006264225A | 2006-10-05 | |||
| JPH0336011A | 1991-02-15 |
Attorney, Agent or Firm:
Hiroshi Arafune
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