To provide an inner lead of a lead frame in a semiconductor package, especially for a small thin QON package, capable of being bent at a bending part with an acute angle and easy to mount with an ensured terminal length without resin burs of molding resin at the bending part.

An inner lead 10 of a lead frame in a semiconductor package has a V-shaped groove 14 extended sidewise at a surface bending part 10a. In a bending method, a bending part 10A of the inner lead 10 with the V-shaped groove 14 can be bent with an abrupt angle of θ in a double bending method.