Title:
無機質板、天井仕上げ材、天井構造及び無機質板の製造方法
Document Type and Number:
Japanese Patent JP7406353
Kind Code:
B2
Abstract:
To provide an inorganic board A, in which the inorganic board A is made less likely to be bent by effectively suppressing the inhibition of binding function from binding material in inorganic board A by water content.SOLUTION: The inorganic board A contains an inorganic fiber material by 70 to 80 wt.%, an inorganic powder by 13 to 26 wt.%, and a binding material containing a water-based adhesive, whose binding strength decreases due to absorption of moisture or water content, as a main component by 4 to 7 wt.%, and in which the inorganic powder among them contains, as a moisture conditioning inorganic powder having a moisture conditioning property, B-type silica gel by 4 to 12 wt.% per total of inorganic board A.SELECTED DRAWING: Figure 10
Inventors:
Kozo Tamamura
Takuya Kotani
Kohei Hara
Takuya Kotani
Kohei Hara
Application Number:
JP2019209464A
Publication Date:
December 27, 2023
Filing Date:
November 20, 2019
Export Citation:
Assignee:
Daiken Industry Co., Ltd.
International Classes:
C04B38/00; E04B9/04; E04B9/24
Domestic Patent References:
| JP2006281512A | ||||
| JP201542827A | ||||
| JP2014173227A | ||||
| JP4143486B2 |
Attorney, Agent or Firm:
Patent Attorney Corporation Maeda Patent Office
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