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Title:
インシツマイクロカプセル化された接着剤
Document Type and Number:
Japanese Patent JP4955899
Kind Code:
B2
Abstract:
A novel adhesive formed in situ in a microcapsule and method for forming such a pressure sensitive or flowable adhesive in situ in a microcapsule is disclosed. The method for forming the novel adhesive comprises providing an aqueous mixture of wall material in water; adding a substantially water insoluble core material, free radical initiator, and a solvent for the pre-polymers to the aqueous mixture. The core material comprises a first addition polymerizable pre-polymer having a Tg of less than about 0° C., a flash point of at least 75° C., and a boiling point of at least 175° C. These are typically selected from acrylate or methacrylate type materials. Optionally included is a second addition polymerizable pre-polymer for providing cross-linking or interaction between polymer chains. High shear agitation is provided to the aqueous mixture to achieve a particle size of about 0.1 to 250 microns. Stirring at a first temperature effects capsule wall formation; and heating to a second temperature polymerizes the pre-polymers of the core material to form an adhesive in situ in the formed capsules.

Inventors:
Schwanz Todd Erlin
Application Number:
JP2002525692A
Publication Date:
June 20, 2012
Filing Date:
August 30, 2001
Export Citation:
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Assignee:
APPLETON PAPERS INCORPORATED
International Classes:
B01J13/14; C09J4/00; B01J13/04; B01J13/10; B01J13/16; C08F2/16; C08F20/10; C08F265/04; C08F285/00; C09J11/06; C09J123/00; C09J133/00; C09J151/00; C09J157/00; C09J193/00; C09J201/00
Domestic Patent References:
JP6234957A
JP2102280A
JP60068045A
JP7144126A
Attorney, Agent or Firm:
Junyuki Morita