To lower cost, increase positioning accuracy, and to enable adaptation to narrow-pitch and many-pin constitution.

This electronic component inspecting device is equipped with a contact probe 1, having contact pins 2a which are brought into contact with electrode terminals P of an electronic component C to perform electric inspection, probe support mechanisms (3 and 4) which position and support the contact probe 1, and a component holding mechanism 5, which positions the electronic component C and hold the contact pins 2a and electrode terminal P in contact. The contact probe 1 comprises a tape-like film 7 and pattern wires 2 formed on the surface of the film 7, device holes 7a which are separated from one another along the length of the film 7 are formed on the film 7, and the pattern wires 2 are arranged having their tips projected into the device holes 7a to form contact pins 7a.