To provide an inspecting method for an electrooptical device, which can precisely inspect optical characteristics even when a pixel size becomes narrow and, preferably, facilitates automation of inspection and can physically measure various functional films formed on a substrate.
The inspecting method for the electrooptical device uses an inspection pattern 150 formed by forming a metal film pattern 129 formed at the same time with a metal film in a display area on an organic film pattern 115 formed at the same time with an organic film in the display area for inspection of a functional member formed by stacking a metal film on an organic film. Optical characteristics of the functional member are measured by irradiating an island-shaped part 150a formed by forming the metal film pattern 129 on the island-shaped organic film pattern 115a with inspection light and a film thickness of the organic film and/or metal film of the functional member is measured by scanning a surface of a projection part 150b formed by forming a metal film pattern 129b partly on an organic film pattern 115b with a probe.
OTAKE TOSHIHIRO
KANEKO HIDEKI
HORIGUCHI MASAHIRO
YOSHIDA KOJI
Masatake Shiga
Masakazu Aoyama