Title:
INSPECTING METHOD OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH05256790
Kind Code:
A
Abstract:
PURPOSE: To detect the defects occurring in a wiring pattern of a printed wiring board having wiring patterns formed on the surface and the rear, by single inspection.
CONSTITUTION: An optical-type pattern inspecting apparatus uses two sets of image intake devices comprising projectors 8 and first and second light- sensing inspection heads 6 and 7, and others, and it is so constructed as to inspect discretely each side of a printed wiring board 1 having a wiring pattern 3 formed on the surface by an etching method. By this apparatus, both sides of the printed wiring board or an inner layer board thereof immediately after etching are inspected simultaneously.
More Like This:
Inventors:
Yoshinori Goto
Application Number:
JP5315392A
Publication Date:
October 05, 1993
Filing Date:
March 12, 1992
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
G01B11/24; G01B11/245; G01N21/88; G01N21/956; G01R31/02; G06T1/00; H05K3/00; (IPC1-7): G01N21/88; G01B11/24; G01R31/02; G06F15/62; H05K3/00
Attorney, Agent or Firm:
Kunihiko Wakabayashi