To obtain an inspection apparatus by which the formation state of a protruding part formed on a pad at a semiconductor device or on an object- side pad used to bond the semiconductor device is inspected with good accuracy.

A plurality of illumination parts 1 to 5 which irradiate a protruding part, to be inspected, from respectively different angles are changed over sequentially, and the image of the protruding part to be inspected is fetched every time by a camera 6 which is attached at the upper part of the protruding part to be inspected. A measuring means 13 binarizes the image which is fetched by the camera, it measures a feature amount such as a circumscribed rectangular size, a circularity, an average gray level or the like, a judgment means 14 judges the protruding part to be defective when it is not within a nondefective range which is set in every lighting operation which is turned on in advance, and the formation state of the protruding part is inspected with good accuracy.