PURPOSE: To accurately detect the mounting position of a chip component by providing a deviation quantity calculating means which calculates the deviation quantity of each slit light beam detected by a slit light position detecting means from a reference position.
CONSTITUTION: Slit light beams 5 and 6 emitted by slit lighting devices 3 and 4 are projected on a circuit board 2 through galvanomirrors 7 and 8. The image signal of the substrate 2 which is outputted by an image pickup device 9 is A/D-converted 10 and stored 12 as digital image data. This image data is converted 13 into a binary signal, which is sent to a window setting circuit 15. The circuit 15 sets a window at a lengthwise part irradiated with the slit light beams 5 and 6 and partial image data is extracted. A peripheral distribution arithmetic circuit 16 finds integral values of density levels of picture elements by partial image data to find the positions of the slit light beams 5 and 6. Those respective positions are compared by a deviation quantity calculating circuit 18 with a reference position to calculate the quantity of the deviation due to the curvature, etc., of the board 2, and the deviation quantity is sent out as a position correcting value to a galvanomirror control circuit 21 through a control circuit 20.
| JPH11183390 | SURFACE INSPECTING METHOD AND DEVICE |
| JPH10267627 | METHOD AND DEVICE FOR INSPECTING LEAD FRAME |
| JPS62188947 | INSPECTION APPARATUS FOR PART PACKAGING CIRCUIT BOARD |
INOUE MITSUJI
KOMATSU TADANORI
Next Patent: METHOD FOR DIAGNOSING COATING FILM DETERIORATION WITH LASER BEAM