To provide an inspection method in which a detection rate of a pattern defect is enhanced by stabilizing an electrified state of a wafer which quickly releases static electricity, and which has a superior throughput.
In the inspection method in which a pattern formed on the substrate is inspected based on signals generated from the substrate by an irradiation of charged particles, inspections are carried out by using a means in which charged particle rays are irradiated in a plurality of times at the same inspecting position immediately before detecting the signals from the substrate, a means by which a plurality of signals are detected that are generated by the irradiation of a plurality of times, and a means in which only the signals of a specific frequency are image-formed.
MIYAI YASUSHI
NOJIRI MASAAKI
JPH09180667A | 1997-07-11 | |||
JPH06124681A | 1994-05-06 | |||
JPS5940527A | 1984-03-06 | |||
JP2003083917A | 2003-03-19 | |||
JPH07287055A | 1995-10-31 | |||
JPH10294345A | 1998-11-04 |
Next Patent: AV EQUIPMENT