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Title:
INSPECTION DEVICE AND INSPECTION METHOD OF CIRCUIT PATTERN
Document Type and Number:
Japanese Patent JP2006331825
Kind Code:
A
Abstract:

To provide an inspection method in which a detection rate of a pattern defect is enhanced by stabilizing an electrified state of a wafer which quickly releases static electricity, and which has a superior throughput.

In the inspection method in which a pattern formed on the substrate is inspected based on signals generated from the substrate by an irradiation of charged particles, inspections are carried out by using a means in which charged particle rays are irradiated in a plurality of times at the same inspecting position immediately before detecting the signals from the substrate, a means by which a plurality of signals are detected that are generated by the irradiation of a plurality of times, and a means in which only the signals of a specific frequency are image-formed.


Inventors:
HAYAKAWA KOICHI
MIYAI YASUSHI
NOJIRI MASAAKI
Application Number:
JP2005153219A
Publication Date:
December 07, 2006
Filing Date:
May 26, 2005
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP
International Classes:
H01J37/28; H01J37/20; H01J37/22; H01L21/66
Domestic Patent References:
JPH09180667A1997-07-11
JPH06124681A1994-05-06
JPS5940527A1984-03-06
JP2003083917A2003-03-19
JPH07287055A1995-10-31
JPH10294345A1998-11-04
Attorney, Agent or Firm:
Yukihiko Takada