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Title:
平面形状測定システムの点検装置
Document Type and Number:
Japanese Patent JP7431195
Kind Code:
B2
Abstract:
To provide an inspection device of a planar shape measurement system which can easily perform inspection.SOLUTION: An inspection device 10 according to an embodiment inspects a planar shape measurement system comprising: a light projection device 2 which emits two parallel slit-like light beams; an imaging device 3 which is provided so as to capture reflection images of the two parallel slit-like light beams from an oblique direction; and a planar shape measurement device 20 which converts each of the two parallel slit-like light beams of the imaged reflection image data into data of coordinates of the surface height and outputs the data. The inspection device can record and output the reflection image data together with the acquisition date and time, and outputs determination data of the inspection result of the planar shape measurement system on the basis of the data output by the planar shape measurement device. An inspection jig 1 has a length over the second direction of a measurement area in the plan view and is bent due to dead weight when being set in the measurement area. The determination data includes a bending amount of the inspection jig output by the planar shape measurement device.SELECTED DRAWING: Figure 1

Inventors:
Shooting range fair
Masayuki Sugiyama
Application Number:
JP2021093423A
Publication Date:
February 14, 2024
Filing Date:
June 03, 2021
Export Citation:
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Assignee:
Toshiba Mitsubishi Electric Industrial Systems Co., Ltd.
International Classes:
G01B11/25; B21B38/02; B21C51/00
Domestic Patent References:
JP2021067480A
JP7151526A
JP2020159774A
JP2018048979A
JP2012251816A
JP2004226240A
Attorney, Agent or Firm:
Masahiko Hyugaji
Junichi Kozaki
Hiroshi Ichikawa
Takato Uchida