To provide an inspection device that can surely inspect a band-like metal for incomplete reflow-soldered states even when the metal is transported in a meandering state.

This inspection device for the band-like metal 1 uses a fiber line lighting means 3 and a line-scanning camera 2. When the position of one side face of the band-like metal continuously changes inwardly, by m pixels or more from the position of the side face in the preceding line for n lines or more and the other side face of the metal continuously changes outward by m pixels or more from the position of the side face in the preceding line for n lines or more, the inspection device discriminates that the position of one side face varies due to meandering transport of the metal. When the position of the other side face does not change to the outside by m pixels or more from the position of the side face in the preceding line for n lines or more, a device discriminates that a defect, such as an incomplete reflow-soldered state, etc., is formed near the position of one side face of the band-like metal.