Title:
検査装置
Document Type and Number:
Japanese Patent JP4402004
Kind Code:
B2
Abstract:
This invention relating to an inspection apparatus capable of classifying defects at high accuracy makes it possible to accurately extract various characteristic quantities of each defect by using the images obtained by imaging a semiconductor wafer under dark-field illumination, and providing, with respect to a differential image signal between the image signals obtained from dies near to each other in image brightness, a defect detection threshold and a characteristic quantity extraction threshold lower than the defect detection threshold.
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Inventors:
Hamamatsu Rei
Hisae Shibuya
Shunji Maeda
Hisae Shibuya
Shunji Maeda
Application Number:
JP2005117727A
Publication Date:
January 20, 2010
Filing Date:
April 15, 2005
Export Citation:
Assignee:
Hitachi High-Technologies Corporation
International Classes:
G01N21/88; G01B11/30; G06T1/00; G06T7/00; G06V10/141; G06V10/28; H01L21/66
Domestic Patent References:
| JP2006093172A | ||||
| JP2004271470A | ||||
| JP62200740A | ||||
| JP2004239728A | ||||
| JP200517159A | ||||
| JP20036614A | ||||
| JP10318950A |
Attorney, Agent or Firm:
Polaire Patent Business Corporation
Katsuo Ogawa
Kyosuke Tanaka
Katsuo Ogawa
Kyosuke Tanaka